Even today the quality of solder joints is important for the quality and reliability of the electronic modules in a control unit, particularly with small pitches (<0,5 mm), complex BGA-Components, OFN-Housings and densely equipped assemblies.

The requirements on the soldering quality e.g. according to IPC A610 Class III is the agreed quality for the implementation of solder joints. Workers, test technicians and other specialists must be trained to adhere these quality requirements. Soldering defects which especially occur when repairing assemlies or in the production have to be analysed and avoided by means of process improvements.

TSQS cooperates with the training- and analytical laboratory Trainalytics. Here solder trainings can be offered or solder defect analysis can be jointly implemented.


Link to Trainalytics